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Shrink module size with Flip Chip On Lead (FCOL) package technology
Showing live article 294 of 437 in channel 63439589
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Language: English
Channel Number: 63439589
Article Number: 294
Date: April 20, 2018, 2:00 pm
URL: http://e2e.ti.com/blogs_/b/powerhouse/archive/2018/04/20/shrink-module-size-with-flip-chip-on-lead-fcol-package-technology
GUID: cb01d8b2-d089-468d-babb-77d1d8683490:fd262dc5-27fd-4f6d-af24-277af74d035e
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